The Silicon Components Division carries out research on nanoelectronics and heterogeneous integration on silicon and is focusing on two mains areas: on-going shrinking of CMOS devices to extend Moore’s Law for faster, less-expensive computing power, and the...
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The Silicon Components Division carries out research on nanoelectronics and heterogeneous integration on silicon and is focusing on two mains areas: on-going shrinking of CMOS devices to extend Moore’s Law for faster, less-expensive computing power, and the integration of new capabilities into CMOS, such as sensors, power devices, imaging technology, and new types of memory, to enable new applications.
This booklet contains 39 one-page research summaries covering advances in the focus areas of our Silicon Devices and Technologies Divisions, highlighting new results obtained over the course of 2021.
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